Bars CHIPS Act grant recipients from using federal funds to buy, install, or use certain chipmaking equipment that is made or refurbished by foreign entities of concern.

• Defines completed, fully assembled semiconductor manufacturing equipment and lists covered tools, including deposition, etching, lithography, inspection and test equipment, wafer dicing equipment, wire bonders, and automated material handling systems.
• Requires the Secretary to include in CHIPS funding agreements a 10-year prohibition on using award funds for covered equipment made or refurbished by foreign entities of concern.
• Allows waivers if comparable equipment is not reasonably available from the United States or allied countries, if the equipment was made by a non-concern entity but refurbished by a concern entity, or if its use complies with the Export Administration Regulations and the Secretary finds a national security interest after consulting the Director of National Intelligence or the Secretary of Defense.
• States that no waiver overrides the restrictions on foreign entities of concern in section 9907.

• Science, Space, and Technology Committee (House)
• Energy and Commerce Committee (House)
• Commerce, Manufacturing, and Trade Subcommittee

Foreign Trade and International Finance